Breakdown Analysis of Magnetic Flip-Flop With 28-nm UTBB FDSOI Technology Academic Article

authors

publication date

June 23, 2016

published in

IEEE Transactions on Device and Materials Reliability Journal

Digital Object Identifier (DOI)

https://doi.org/10.1109/tdmr.2016.2584140

has global citation frequency

https://vivo.tib.eu/demo/individual/gcf_W2473720811 Global Citation Count

start page

376

end page

383

volume

16

issue

3