A new technology for CPU chip cooling by concentrated suspension flow of non-colloidal particles Academic Article

authors

Dbouk, Talib

publication date

October 10, 2018

published in

Applied Thermal Engineering Journal

Digital Object Identifier (DOI)

https://doi.org/10.1016/j.applthermaleng.2018.10.044

has global citation frequency

https://vivo.tib.eu/demo/individual/gcf_W2896185157 Global Citation Count

start page

664

end page

673

volume

146