Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling Conference Paper

authors

publication date

April 1, 2014

published in

Digital Object Identifier (DOI)

https://doi.org/10.1109/eurosime.2014.6813820

has global citation frequency

https://vivo.tib.eu/demo/individual/gcf_W2048963320 Global Citation Count

start page

1

end page

7